Circuits imprimés

Épaisseur : 0,8 à 3,0 mm

trou taille : 0,1 mm (4 mil) (minimum)

largeur/interligne : 0,1 mm (4 mil) (minimum)

technique spéciale : aveugle et enterrée par + contrôle d'impédance

matériel: PCB rigide (FR4, CEM-3, en aluminium, âme métallique PCB)

ép. : 0,8 à 3mm

traitement de Surface : HASL / HASL sans plomb, LF-HASL, HAL, Or chimique d'étain, chimique , Immersion : argent/or, OSP, placage à l'or

TG élevé et fréquence

Twist et warp :<1%
0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA
SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
DIP pitches through hole down to 0.60mm
Solder components to underside of board without disrupting topside
Inspection online for AOI and ICT test
X-ray inspection for BGA
High-precision e-testing includes ICT inline, function test, full experienced QC and QA engineer
With RoHS Directive-compliant

0.1mm="" on="" integrated="" circuit="" parts="" with="" so,="" sop,="" soj,="" tssop,="" qfp="" and="" bga=""
smt:="" 0201,="" 0402,="" 0603,="" 0805,="" 1008,="" 1206="" and="" 1210=""
dip="" pitches="" through="" hole="" down="" to="" 0.60mm=""
solder="" components="" to="" underside="" of="" board="" without="" disrupting="" topside=""
inspection="" online="" for="" aoi="" and="" ict="" test=""
x-ray="" inspection="" for="" bga=""
high-precision="" e-testing="" includes="" ict="" inline,="" function="" test,="" full="" experienced="" qc="" and="" qa="" engineer=""
with="" rohs=""> 0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA
SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
DIP pitches through hole down to 0.60mm
Solder components to underside of board without disrupting topside
Inspection online for AOI and ICT test
X-ray inspection for BGA
High-precision e-testing includes ICT inline, function test, full experienced QC and QA engineer
With RoHS Directive-compliant
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